Our partner INESC is highlighting some of the developments resulting from the ongoing collaboration with consortium member PICAdvanced as part of the Microelectronics Agenda funded by the Recovery and Resilience Plan (PRR).
In this snapshot, they have captured one of the stages in the microfabrication process of silicon holders that will later be applied to integrated optical circuits, where cavities are being etched into the Silicon Nitride layer via Reactive Ion Etching (RIE).
At Micro.electronics we share the developments of our Consortium members. Stay tuned for future developments.
