The Chips Joint Undertaking (Chips JU) has opened a new Resilience Call, making €20 million available to support the design and validation of the microelectronic building blocks required for the Front End Module (FEM) of future 6G networks.
The initiative aims to strengthen the competitiveness of the European microelectronics industry by accelerating the development of critical technologies for next-generation wireless communications.
The call focuses on the development of key technologies for an FR3 Front End Module, including:
- Transmitter power amplification and low-noise receiver design;
- Advanced filters, phase shifters and RF data converters;
- Heterogeneous integration and advanced packaging using GaN, CMOS, SiGe and FD-SOI technologies;
- Advanced antenna systems for scalable Massive MIMO and Integrated Sensing and Communications (ISAC).
Proposals should be submitted by consortia bringing together companies, research organisations and academic institutions across the microelectronics and connectivity value chains. Selected projects are also expected to collaborate with the Smart Networks and Services Joint Undertaking (SNS JU) Front End Module (FEM) project.
This funding opportunity represents an important step towards reinforcing Europe’s leadership in microelectronics and enabling the deployment of future 6G communication infrastructures.
Deadline
Applications are open until 16 September 2026, 17:00 (Brussels time).
Find out more and access the full call documentation on the Chips JU website: https://www.chips-ju.europa.eu/Call-Details/?id=8fc5feaf-d070-f111-ab0e-000d3ab6c0a4&fbclid=IwY2xjawTeru5leHRuA2FlbQIxMABicmlkETBBVE5QR2p6MnduWnBLb1lOc3J0YwZhcHBfaWQQMjIyMDM5MTc4ODIwMDg5MgABHo75ta3GDPdr-0cSHpFGUoHpA7c9IuDQ6q2963jo59sLYLXtKtcaTZrOKaFq_aem_7tPlbL12IrQo9tuO14_38Q
