As part of the 50th anniversary lecture series of the Department of Physics at the University of Aveiro, PhotonExport delivered an open technical session focused on deposition technologies for semiconductor manufacturing, bringing together more than 30 participants from academia and industry.
The session provided a comprehensive overview of thin film deposition processes, a cornerstone of modern microelectronics, and their application across the semiconductor manufacturing value chain.
Thin Films at the Core of Semiconductor Devices
Thin films, with thicknesses ranging from a few nanometers to several micrometers, are fundamental to the electrical performance, structural integrity and miniaturization of advanced microchips. Key applications discussed included:
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Gate oxides (SiO₂ / HfO₂) in the 1–5 nm range
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Diffusion barriers (TiN / TaN) between 5–50 nm
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Interlayer dielectrics (100–200 nm)
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Metallization layers
The session emphasized the importance of nanometer-scale precision to ensure device reliability, performance and energy efficiency.
PhotonExport also presented its portfolio in materials and substrates, including sapphire, silicon wafers, sputtering targets and evaporation materials, supporting both research environments and industrial semiconductor processes.
From FEOL to BEOL: Deposition Across the Value Chain
The lecture addressed the distinction between:
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Front-End of Line (FEOL) processes, where advanced transistor architectures such as MOSFET, FinFET and GAAFET are formed through oxidation, dielectric deposition, doping, lithography and etching;
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Back-End of Line (BEOL) processes, responsible for the interconnection of millions or billions of transistors through metal layers, barriers and dielectrics.
This framework positioned deposition technologies within the broader industrial fabrication flow.
Comparing Deposition Technologies
Three core technologies were analyzed:
Atomic Layer Deposition (ALD) – A self-limiting, cyclic process delivering high conformality and atomic-level thickness control, particularly suited for high aspect ratio (AR) structures.
Physical Vapor Deposition (PVD) – Including magnetron sputtering and e-beam evaporation, widely used for metals, oxides and nitrides in both R&D and industrial settings.
Chemical Vapor Deposition (CVD – LPCVD, PECVD, MOCVD) – Enabling batch processing of 25–50 wafers with high uniformity and film quality.
The challenge of filling high aspect ratio structures without void formation was highlighted, underlining the increasing complexity of advanced device architectures.
Industrial Demands and Ecosystem Development
The semiconductor industry’s high capital intensity and strict cleanroom requirements were also addressed. Processing cycles can extend over several weeks per wafer, reflecting the technical rigor involved in advanced device fabrication.
PhotonExport further emphasized sustainable practices, including sputtering target recycling, and its role in supporting universities, R&D centers and pilot fabs through equipment supply and specialized technical training.
Portugal’s Role in the Semiconductor Landscape
The session concluded with a reflection on Portugal’s position within the European semiconductor ecosystem. While the country does not host large-scale manufacturing fabs, it maintains relevant capabilities in chip design, software development, academic research and cleanroom-based prototyping and testing.
In a sector characterized by cyclical investment patterns and driven by demand from artificial intelligence, digital health and advanced electronic systems, continued investment in R&D, talent development and academia-industry collaboration remains critical to strengthening Portugal’s contribution to the global semiconductor value chain.
