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INESC MN is applying its know-how in microfabrication targeting the industrialization of processes for integrated optical circuits in collaboration with Picadvanced

INESC MN is applying its know-how in microfabrication targeting the industrialization of processes for integrated optical circuits in collaboration with Picadvanced.
Today we were reducing the thickness of a 3″ wafer from 388 microns to 250 microns using Etch KOH.

Find out what this partner is developing by clicking here.

 

Agenda da Microeletrónica
Agenda da Microeletrónica
https://micro-electronics.eu

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