IMAPS Nordic would like to welcome you to the IMAPS Nordic Microelectronics Packaging Conference and Exhibition, NordPac 2024, in Tampere, Finland. The event brings together both academics, as well as industry leaders, to discuss and debate state-of-the-art and future trends in microelectronics, packaging, integration, reliability testing, PCB design, assembly and manufacturing of electronics, optics, electronics in health tech, materials, Artificial Intelligence (AI), and Internet of Things (IoT) in electronics. This is the 60th event organised by IMAPS Nordic chapter, and we hope you will celebrate the milestone with us.
Find more here.