The Electronic Components and Technology Conference (ECTC), sponsored by the IEEE Electronics Packaging Society, is the leading international event that brings together the best of science, technology and education in packaging, components and microelectronic systems in an environment of cooperation and technical exchange.
The technical program contains papers covering cutting-edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, photonics, interconnects, materials and processing, assembly and manufacturing technology, components and RF, emerging technologies, among others.
This event offers attendees the opportunity to gain the vision and perspective of technical and business leaders in the sector.
See the program and more information.