According to a report in the ECO newspaper, the South Korean Ambassador...
Read More
Advanced Packaging in GaAs –INL developed a “Temporary Wafer Bonding” (TWB) solution...
Read More
PICadvanced and INESC MN-Centre for Technology and Innovation (CTI) have established a partnership to...
Read More
Semiconductors are present in many sectors and industries. This article, "The Accelerating...
Read More
Today, 9 April, there was a Steering Committee meeting at which the...
Read More
We share this article on how generative artificial intelligence can contribute to...
Read More
The FCT's national co-financing conditions for the 2024 "Chips Joint Undertaking" Partnership...
Read More
More than 30 projects by German companies in the field of microelectronics...
Read More
As part of the presence of Inova-Ria, a consortium member of the...
Read More