Press releases - micro-electronics.eu

2024-05-15

2 min read

Synopsys gave a talk today at the University of Coimbra as part of the Microelectronics Agenda

Synopsys, a consortium member of the PRR-funded Microelectronics Agenda, gave a talk...

Press releases

2024-05-10

4 min read

ALLPROS.eu promotes webinar on "The impact of AI and GenAI on the semiconductor industry"

Artificial Intelligence is fundamentally changing the way companies manage their IT processes...

Press releases

2024-05-07

3 min read

This article highlights three of our Consortium members Synopsys, PicAdvanced and Amkor Portugal

This article highlights three of our Consortium members Synopsys, PicAdvanced and Amkor...

Press releases

aicep-promove-portugal-como-destino-de-investimento-tecnologico

2024-05-06

3 min read

AICEP highlights Portugal in California as an attractive destination for investments in the technology and semiconductor sector

The president of AICEP concluded a visit to California with the aim...

Press releases

2024-04-29

2 min read

Consortium member Inova-Ria is attending F3E with the aim of publicizing the Agenda and making students aware of the sector

The Inova-Ria Consortium Member is taking part in F3E, which is being...

Press releases

2024-04-26

2 min read

The consortium PCI · Creative Science Park Aveiro Region hosted the WP15 working group on the Microelectronics Agenda

In March, PCI - Creative Science Park Aveiro Region hosted the WP15...

Press releases

2024-04-23

7 min read

The T30 event was held last week, where the theme "Expanding horizons for semiconductors in Europe" was debated

Last week saw the T30 Europe event, promoted by Mckinsey & Company,...

Press releases

2024-04-23

3 min read

South Korean companies are expected to invest in the areas of semiconductors (chips) and renewable energies in Portugal this year.

According to a report in the ECO newspaper, the South Korean Ambassador...

Press releases

2024-04-16

5 min read

Advanced Packaging in GaAs - INL developed a “Temporary Wafer Bonding” solution for GaAs wafers, scalable to volume production and multi-wafer panel level processing

Advanced Packaging in GaAs –INL developed a “Temporary Wafer Bonding” (TWB) solution...

Press releases

2024-04-12

6 min read

PICadvanced and INESC MN-Centre for Technology and Innovation (CTI) Form Strategic Partnership

PICadvanced and INESC MN-Centre for Technology and Innovation (CTI) have established a partnership to...

Press releases